Advanced Rework & Die Bonding

Finetech BGA Rework

Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework. We provide solutions for each stage of your journey – from R&D to industrial automated production.  

Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges. The FINEPLACER® systems are designed to be modular for maximum process flexibility and come in manual, semi-automatic or automatic configurations.

Fineplacer
Die Bonding
FINEPLACER® lambda

Precision die attach and advanced chip packaging offering a modular design that can be easily reconfigured for future applications.

FINEPLACER® lambda
FINEPLACER® femto 2

Fully automated sub micron die bonder for advanced packaging applications. A complete machine enclosure ensures highly stable and fully controlled processes.

FINEPLACER femto 2
FINEPLACER® sigma

Sub-micron placement accuracy with 450 x 150 mm2 working area and bonding forces up to 1000 N. Ideal for all types of precision die bonding and flip chip applications.

Fineplacer Sigma
FINEPLACER® femto blu

An automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability for photonic applications.

femto blu
FINEPLACER® pico 2

Multi-purpose, manual die bonder with placement accuracy down to 3 µm’

FINEPLACER® pico 2
Advanced Rework
FINEPLACER® coreplus

A dedicated rework system that offers Finetech’s long proven rework technology for a wide spectrum of SMD components, ranging in size from 01005 to 90 mm x 90 mm.

FINEPLACER coreplus
FINEPLACER® pico rs

An enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments.

FINEPLACER pico rs